Showing posts with label icip. Show all posts
Showing posts with label icip. Show all posts

December 26, 2013

Image processing for materials characterization (ICIP 2014, special session)


ICIP 2014, the IEEE International Conference on Image Processing, will take place in Paris (la Défense, to be honest) during 27-30 October 2014. The twenty special sessions have been announced (see below).
One is devoted to the exciting field of Materials science: "Image processing for materials characterization", with one introductory and five invited papers.

CLICK THE PICTURE FOR THE DEDICATED PAGE
 The deadline for paper submission is 14 February 2014. We encourage interested authors to submit as many papers as possible around this topic (ICIP 2014 submission information), and to warn one the special session organizers. Beware: the existence of the special session on "Image processing for materials characterization" does not grant, by no mean, acceptance or even higher odds to the main conference tracks.

Context
Scanning electron microscopy (SEM): or Mr. Jack (c) F. Moreau, IFPEN
A microscopic Mister Jack (left) announces the present conference/special session.  Materials science is evolving from materials discovered in Nature by chance to designed materials [1], that repair themselves, adapt to their environment, capture and store energy or information, help elaborate new devices, etc. Materials are now designed from scratch with initial blueprints, starting from atoms and molecules,   as more traditional for buildings or electronic circuits. This evolution, at the confluence of science, technology, and engineering [2], is driven by the synergy of materials science and physics, mechanics, chemistry, biology and engineering, with image processing  taking part in this challenge [3]. Indeed, the possibility of designing, analyzing and modeling materials from images (or generally two- or three-dimensional modalities) reveals important contributions to this field. The  appearance of materials  changes significantly with imaging techniques, depending  on the scale of analysis, imaging settings, physical properties and preparation of materials. Understanding these aspects turns out to be crucial for material analysis and modelization.

In particular, we face challenges regarding the characterization of the physical assembly process of materials, the formation process of images, of imaging techniques interacting with materials (geometry, transmission, illumination, reflection, scattering). Answering these questions is important to separate the material appearance from its intrinsic morphology and properties. Additionally, materials science approaches may inspire novel image processing techniques.
We make an analogy between images and statistical mechanics systems. Pixel gray levels and the presence and orientation of edges are viewed as states of atoms or molecules in a lattice-like physical system.
By gathering researchers of complementary expertise, from image feature extraction to image simulation, this special session proposal will allow us to report on recent progresses performed and emerging trends in material analysis and modelization through image processing. By attracting an audience with diverse backgrounds, this proposal aims at catalyzing a new community around this exciting new area for the image processing crowd. The special session topics will be publicized, to encourage  additional submissions to the main ICIP session tracks.

Scope
Scanning electron microscopy (SEM): Catalyst section with cracks and inclusions.
This special session aims at showing some relevant problems in material characterization that can be addressed with classical or advanced methods of signal and image processing. It will be introduced by a tutorial presentation, given by the organizers, who will offer a large overview of some of the issues that may be addressed in this application domain, such as dealing with different modalities (optical, scanning or transmission electron microscopy; diffractometry; spectrometry; surface analysis instrumentation...) and applications (porous, fibrous and hard materials; membranes, surfaces and interfaces; clean energy and information storage; chemistry and catalysts; geology; forensics; bio-inspired materials and biomedical  [4]). For illustrating and to widen the points of view of the tutorial, the five invited papers of the session address some of these challenges by employing various methods, e.g. restoration; segmentation; mathematical morphology; texture analysis [5]; multiscale and directional features extraction; color and multispectral processing; stochastic models [6]. Organizing committee information is given on the next page, followed  by invited authors' contributions, in shape of  expanded abstracts, preliminary results and references. The proposal is concluded by a discussion on the authors' expertise.


Topics of interest include (but are not limited to):
  • Modalities: optical, scanning or transmission electron microscopy; diffractometry; spectrometry; surface analysis instrumentation…
  • Approaches: restoration; segmentation; mathematical morphology; texture analysis; multiscale and directional features extraction; color and multispectral processing; stochastic models; rendering; sparse sensing…
  • Applications: porous, fibrous and hard materials; membranes, surfaces and interfaces; clean energy and information storage; chemistry and catalysts; geology; forensics; bio-inspired materials and biomedical
Thanks to:
Nuit Blanche: Novel meetings: Image processing for materials characterization (ICIP 2014, special session), Spin Glass and Beyond: An old tool for new problems, ITWIST'14 deadline extended 
IFPEN

The list of ICIP 2014 special sessions:
SS-1: Variational and Morphological Optimizations: A Tribute to Vicent Caselles
Organizers: Jean Serra, Guillermo Sapiro, and Philippe Salembier

SS-2: Learning Image Features to Encode Visual Information
Organizers: Jesús Malo, Javier Portilla, and Joan Serra-Sagristà

SS-3: Plenoptic Imaging (Capture, Representation, Processing, and Display)
Organizers: Mårten Sjöström and Atanas Gotchev

SS-4: Photon-Limited Image Reconstruction
Organizers: Charles Deledalle and Joseph Salmon

SS-5: Hyperspectral Image Processing
Organizers: Saurabh Prasad and Jocelyn Chanussot

SS-6: Compact Feature-Based Representation of Visual Content
Organizers: Giuseppe Valenzise and Marco Tagliasacchi

SS-7: Advances in Optimization for Inverse-Imaging Problems
Organizers: Jalal Fadili and Gabriel Peyré

SS-8: Quality of Experience in 3D Multimedia Systems
Organizers: Janko Calic, Philippe Hanhart, Patrick Le Callet, and Alexandre Pereda

SS-9: Advances in Astronomical Signal and Image Processing
Organizers: Jérôme Bobin and Yves Wiaux

SS-10: Image Processing for Materials Characterization
Organizers: Maxime Moreaud, Laurent Duval, Camille Couprie, Dominique Jeulin, Jesús Angulo, and Hugues Talbot

SS-11: Realistic 3D in Interactive Virtual Worlds
Organizers: Julie Wall and Ebroul Izquierdo

SS-12: Electron-Microscopy Image-Processing Problems and Applications in Biology: From Structure to Dynamics
Organizers: Slavica Jonic and Carlos Oscar Sanchez Sorzano

SS-13: Advances in Facial Morpho-Functional Sign Recognition and Analysis
Organizers: A. Enis Cetin, Sara Colantonio, and Bogdan J. Matuszewski

SS-14: Synthetic Aperture Radar Imaging
Organizers: Daniele Riccio

SS-15: 3D Data Security
Organizers: William Puech and Adrian Bors

SS-16: 3D Multimedia Experience Over the Future Internet
Organizers: Safak Dogan, Erhan Ekmekcioglu, and Ahmet Kondoz

SS-17: Efficient Design of HEVC Video-Codec Implementations
Organizers: Vivienne Sze

SS-18: Behavior Imaging
Organizers: Séverine Dubuisson, Jean-Marc Odobez, and Mohamed Chetouani

SS-19: Image Processing for the Detection of Road-Surface Degradations
Organizers: Paulo Lobato Correia and Henrique Oliveira

SS-20: Privacy-Preserving Multimedia Content Analysis: Privacy by Design and Social-Impact Analysis
Organizers: Atta Badii, Touradj Ebrahimi, Jean-Luc Dugelay, Ebroul Izquierdo, Thomas Sikora, Leon Hempel, Christian Fedorczak, and Diego Fernandez Vazquez

September 7, 2012

SIVA Conferences : concern fees (update)

Although conferences = concern fees (with the anagram equivalence) for a few organizers, they allow to grab a few call for papers to other conferences. Grabbed from EUSIPCO 2012, along with cfp1 and cfp2 (on time-frequency theory and applications), and after a couple of proofs from a finally painfully published paper in Geophysics, the recent opening of GRETSI 2013 website in Brest, France, provides a good opportunity to release the latest updates on Signal, Image and Volume Analysis (SIVA) Conferences:

Eurographics 2013 (Annual conference of the European Association for Computer Graphics) calls for papers on 21/09/2013. CVPR 2015 (IEEE Conference on Computer Vision and Pattern Recognition) is announced in Boston, Massachussetts, USA; ICIP 2016 (IEEE International Conference on Image Processing) in Phoenix, Arizona, USA; ICCV 2015 (International Conference on Computer Vision) in Santiago, Chile. 

One of the next target is ICASSP 2013 in Vancouver, Canada, with submission deadline on 19/11/2012. And many more at SIVA Conferences...

For those interested in writing time-frequency papers, two special issue call for papers:

July 19, 2010

Upcoming SIVA signal and image conferences - Concern fees

Today we update on the SIVA: Signal, Image, Video and Applications conferences page.


Long time ahead is ICASSP 2014 website running. Not much information yet, execpt in this information pdf file, like a call to image processing tools like inpainting. ICIP 2013 (Melbourne, Australia), ICASSP 2013 (Vancouver, Canada) are open but scarse as well.

Closer from us, SAMPTA 2011 held in Singapore (deadline on 01/10/2010), ISCAS 2011 in Rio de Janeiro, Brazil (deadline on 29/09/2011, sooner for Special sessions), ICASSP 2011 in Prague, Czech Rebublic (deadline on 20/10/2010), ICCV 2011 in Barcelona, Spain (deadline on 01/03/2011). ICIP 2011 in Brussels, Belgium, has no deadline for now. MWSCAS 2011, once believed in Brazil, will be in fabulous Seoul, South Korea (deadline 04/03/2010). SIVA would not be complete without the annual Conference on Digital Image Content Knowledge, held in Chicago, Illinois, USA. For myself, i will try to enjoy the shores of Saint-Malo at LVA/ICA 2010, the ninth conference on latent variable analysis and signal separation.


All this comes with a nomade gift: Skype version 5.0 for a portable use on a usb key.For people who like to do it themselves, look here.

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